DocumentCode
1409962
Title
Modeling of high current density trench gate MOSFET
Author
Dharmawardana, K. G Pani ; Amaratunga, Gehan A J
Author_Institution
Dept. of Eng., Cambridge Univ., UK
Volume
47
Issue
12
fYear
2000
fDate
12/1/2000 12:00:00 AM
Firstpage
2420
Lastpage
2428
Abstract
This paper presents a semianalytical model developed for the ON state (VG>VT) of trench gate MOSFETs. It incorporates a more realistic model for the inversion channel region, taking the effects of doping variation, transverse, and longitudinal electric fields including the surface scattering, into consideration. Accurate modeling of the inversion channel region is of paramount importance, especially in the case of low voltage power devices where the inversion channel resistance is a significant portion of the overall resistance. The carrier velocity saturation at high longitudinal electric fields is also taken into account in the formulation of the model. The proposed model is supported by both numerical simulation results using MEDICI and experimental results, which are in good agreement with the results of the model. This can be a useful tool in the design of optimum devices.
Keywords
current density; power MOSFET; power semiconductor switches; semiconductor device models; semiconductor doping; surface scattering; MEDICI; ON state; carrier velocity saturation; doping variation; high current density trench gate MOSFET; high longitudinal electric fields; inversion channel region; inversion channel resistance; longitudinal electric fields; low voltage power devices; numerical simulation; semianalytical model; surface scattering; transverse electric fields; trench gate MOSFETs; Current density; Doping; Electric resistance; Immune system; Low voltage; MOSFET circuits; Numerical simulation; Scattering; Semiconductor process modeling; Surface resistance;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.887031
Filename
887031
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