DocumentCode :
1409979
Title :
Reliability assessment of electronic components exposed to long-term non-operating conditions
Author :
McCluskey, F. Patrick ; Hakim, Edward B. ; Fink, John ; Fowler, Andre ; Pecht, Michael G.
Author_Institution :
CALCE, Maryland Univ., College Park, MD, USA
Volume :
21
Issue :
2
fYear :
1998
fDate :
6/1/1998 12:00:00 AM
Firstpage :
352
Lastpage :
359
Abstract :
The decreased availability of MIL-SPEC components is forcing designers of low volume complex electronic systems, such as avionics and defense electronics, to consider the use of commercial off-the-shelf plastic encapsulated microcircuits (COTS PEMs). Traditionally, designers of these long-life, high reliability systems have been reluctant to use COTS PEMs because of concerns related to their capability to survive in harsh environments over long periods of continuous or intermittent operation. Many commercial insertion studies in the last several years have now conclusively demonstrated that PEMs made using best commercial materials, processes, and quality techniques will permit devices to perform reliably in the most severe environments. However, only recently have studies focused on the reliability of PEMs in that subset of applications requiring short time operation after long periods of unpowered storage (10 to 20 yrs). This paper presents the results of five critical commercial insertion studies focusing on long term storage reliability. These studies include analysis of PEMs, hermetic microcircuits, and assemblies stored for up to 28 yrs in various storage locations around the world. Regardless of the storage conditions, commercial grade PEMs, without screening or incoming inspection, survived assembly and extended storage, even though, in some cases, degradation was observed on the boards
Keywords :
encapsulation; integrated circuit packaging; integrated circuit reliability; plastic packaging; COTS PEM; avionics; commercial insertion; commercial off-the-shelf plastic encapsulated microcircuit; defense electronics; electronic component; harsh environment; hermetic microcircuit; long term dormant storage; low volume complex system; reliability; Aerospace electronics; Assembly; Automotive electronics; Availability; Costs; Electronic components; Electronics packaging; Marketing and sales; Plastics; Semiconductor device packaging;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/95.705484
Filename :
705484
Link To Document :
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