DocumentCode :
1410902
Title :
The Application of Overstress Testing-to-Failure to Airborne Electronics-A Status Report
Author :
Bussolini, Jacob J.
Author_Institution :
Grumman Aircraft Engineering Corp., Bethpage, N. Y. 11714
Issue :
2
fYear :
1968
fDate :
3/1/1968 12:00:00 AM
Firstpage :
142
Lastpage :
148
Abstract :
Several years of study and actual testing have answered many of the previously controversial questions about the application of environmental overstress testing-to-failure as a useful tool for reliability evaluation. The answers included the fact that more than 65 percent of the failures occurring under overstress environments were duplicates of experienced operational failures. Improvements of 5 to 1 in reliability levels have resulted from application of results of overstress tests, which consumed less than 200 hours of actual test time. Overstress tests have also been used as a method of evaluating multiplesource designs. The first in a required series of indices has been derived, which may assist in the eventual use of overstress testing for reliability index measurement.
fLanguage :
English
Journal_Title :
Aerospace and Electronic Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9251
Type :
jour
DOI :
10.1109/TAES.1968.5408952
Filename :
5408952
Link To Document :
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