DocumentCode
1410902
Title
The Application of Overstress Testing-to-Failure to Airborne Electronics-A Status Report
Author
Bussolini, Jacob J.
Author_Institution
Grumman Aircraft Engineering Corp., Bethpage, N. Y. 11714
Issue
2
fYear
1968
fDate
3/1/1968 12:00:00 AM
Firstpage
142
Lastpage
148
Abstract
Several years of study and actual testing have answered many of the previously controversial questions about the application of environmental overstress testing-to-failure as a useful tool for reliability evaluation. The answers included the fact that more than 65 percent of the failures occurring under overstress environments were duplicates of experienced operational failures. Improvements of 5 to 1 in reliability levels have resulted from application of results of overstress tests, which consumed less than 200 hours of actual test time. Overstress tests have also been used as a method of evaluating multiplesource designs. The first in a required series of indices has been derived, which may assist in the eventual use of overstress testing for reliability index measurement.
fLanguage
English
Journal_Title
Aerospace and Electronic Systems, IEEE Transactions on
Publisher
ieee
ISSN
0018-9251
Type
jour
DOI
10.1109/TAES.1968.5408952
Filename
5408952
Link To Document