• DocumentCode
    1410902
  • Title

    The Application of Overstress Testing-to-Failure to Airborne Electronics-A Status Report

  • Author

    Bussolini, Jacob J.

  • Author_Institution
    Grumman Aircraft Engineering Corp., Bethpage, N. Y. 11714
  • Issue
    2
  • fYear
    1968
  • fDate
    3/1/1968 12:00:00 AM
  • Firstpage
    142
  • Lastpage
    148
  • Abstract
    Several years of study and actual testing have answered many of the previously controversial questions about the application of environmental overstress testing-to-failure as a useful tool for reliability evaluation. The answers included the fact that more than 65 percent of the failures occurring under overstress environments were duplicates of experienced operational failures. Improvements of 5 to 1 in reliability levels have resulted from application of results of overstress tests, which consumed less than 200 hours of actual test time. Overstress tests have also been used as a method of evaluating multiplesource designs. The first in a required series of indices has been derived, which may assist in the eventual use of overstress testing for reliability index measurement.
  • fLanguage
    English
  • Journal_Title
    Aerospace and Electronic Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9251
  • Type

    jour

  • DOI
    10.1109/TAES.1968.5408952
  • Filename
    5408952