DocumentCode :
1411066
Title :
Thermal breakdown of solid dielectrics
Author :
Moon, P. H.
Author_Institution :
Massachusetts Institute of Technology, Cambridge
Volume :
50
Issue :
8
fYear :
1931
Firstpage :
676
Lastpage :
676
Abstract :
The purpose of this paper is to correlate the work which has been done on thermal breakdown and to put it in a form in which it can be used by the electrical engineer in the calculation of breakdown voltage. Besides a treatment of the Fock theory, the paper includes the derivation of new formulas for breakdown of very thin and very thick samples and for internal temperature rise and current.
Keywords :
Capacitance; Dielectrics; Electric breakdown; Insulation; Resistance; Solids; Stress;
fLanguage :
English
Journal_Title :
Electrical Engineering
Publisher :
ieee
ISSN :
0095-9197
Type :
jour
DOI :
10.1109/EE.1931.6430367
Filename :
6430367
Link To Document :
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