DocumentCode
1411174
Title
The role of the good-die project in miniaturized-system design
Author
Truzzi, Claudio
Author_Institution
IMEC, Leuven, Belgium
Volume
15
Issue
3
fYear
1998
Firstpage
35
Lastpage
43
Abstract
Existing CAD tools need major changes to cope with the design requirements of high-density packaging technologies. A database service is now available on the Internet to address one area of great need-bare-die component selection and automated generation of component symbols
Keywords
Internet; circuit CAD; information services; packaging; CAD tools; GoodDie Internet Service; Internet; MCM design automation; bare-die component selection; component symbols; database service; high-density packaging; Application specific integrated circuits; Design automation; Driver circuits; Engines; Manufacturing; Packaging; Power system interconnection; Production systems; Switches; System testing;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/54.706031
Filename
706031
Link To Document