DocumentCode
141171
Title
Multimodal flexible sensor for healthcare systems
Author
Van Anh Ho ; Sho Imai ; Hirai, Shinichi
Author_Institution
Adv. Res. Center, Mitsubishi Electr. Corp., Amagasaki, Japan
fYear
2014
fDate
26-30 Aug. 2014
Firstpage
5976
Lastpage
5979
Abstract
This paper describes potential applications of our previously developed fabric sensor into wearable healthcare or nursing systems based on its sensing modalities. This sensor is knitted from tension-sensitive electro-conductive yarns; whose structure has an elastic core, wound around by two separated tension-sensitive electro-conductive threads. This makes the sensor inherently flexible and stretchable, allowing it to conform to any complicated surface. We have equipped the sensor with three modalities, including proximity that allows the sensor to estimate a distance from the sensor to human hand and activates a light touch sensing, which could initiate comfortable and friendly interfaces in order to reduce burden of patients/disable people during interactions with healthcare devices; tactile perception that can measures contact force or applied load, especially realize slippage acting on the sensor surface, which is promising to be embedded into wearable devices or smart carpets; and tensile that can quantify a volume´s contraction/expansion, which can be employed to monitoring muscles activity and so on.
Keywords
biomedical electronics; flexible electronics; force sensors; pressure sensors; yarn; applied load; contact force; elastic core; fabric sensor; light touch sensing; multimodal flexible sensor; sensing modalities; slippage; stretchable sensor; tactile perception; tension sensitive electroconductive threads; tension sensitive electroconductive yarns; volume contraction; volume expansion; wearable healthcare systems; wearable nursing systems; Fabrics; Medical services; Muscles; Robot sensing systems; Surface resistance; Yarn;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2014.6944990
Filename
6944990
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