Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength part II-breakdown strength

The aim of this research is to find a way to achieve the epoxy composites with high thermal conductivity and acceptable dielectric breakdown (BD) strength. A value 12.3 W/m·K is the highest thermal conductivity obtained for epoxy composite in Part I. Dielectric breakdown performances such as short-time dielectric breakdown strength (BD strength), partial discharge (PD) resistance and BD time for composites were investigated in the Part II. In general, micro filler inclusion will increase thermal conductivity and decrease dielectric breakdown performance. Influencing factors are considered to be the orientation of filler, the content of void space, the content ratio in the case of co-mixing, the addition of nano filler, and filler surface modification. Twenty six kinds of composites were prepared in consideration of the above influencing factors. There are two options for most appropriate ones among the composites evaluated in the research. One is an epoxy/ conglomerated h-BN composite with co-loaded nano SiO₂ and micro AIN filler. It has 12.3 W/m·K in thermal conductivity, 75.1 kV_peak/mm in BD strength and 260 % of BD time for neat epoxy. It is most suitable when low BD strength and high thermal conductivity is needed. The other one is an epoxy/ h-BN composite with co-loaded nano silica and AIN filler for requirement of very high BD strength but lower thermal conductivity. Optimum thermal conductivity is obtained if flaky h-BN filler is oriented in parallel to heat flow. Since it is difficult to realize full orientation, the use of conglomerated h-BN filler is a suitable option. Optimum BD performance is obtained if void space is reduced by certain methods such as co-dispersion of different size fillers and addition of nano filler.