Title :
Transfer-Printed Microscale Integrated Circuits for High Performance Display Backplanes
Author :
Bower, Christopher A. ; Menard, Etienne ; Bonafede, Salvatore ; Hamer, John W. ; Cok, Ronald S.
Author_Institution :
Semprius, Inc., Durham, NC, USA
Abstract :
Active-matrix organic light-emitting diode displays have been fabricated using backplanes with transfer-printed microscale silicon integrated circuits (ICs) in place of conventional thin-film transistors. The ICs were fabricated using a commercially available semiconductor foundry process, and the wafers were subsequently processed to prepare the ICs for transfer-printing. The microscale ICs were transfer printed onto glass substrates and interconnected using a single-level, thin-film metallization process. The resulting OLED display exhibited good pixel-to-pixel luminance uniformity, high luminance, excellent controllability and high switching speed. The transfer-printing process achieved good positional accuracy and high yield.
Keywords :
LED displays; elemental semiconductors; glass; integrated circuit metallisation; silicon; thin film transistors; OLED display; Si; active-matrix organic light-emitting diode displays; commercially available semiconductor foundry process; conventional thin-film transistors; glass substrates; high performance display backplanes; high switching speed; pixel-to-pixel luminance uniformity; thin-film metallization process; transfer-printed microscale integrated circuits; Active matrix organic light emitting diodes; Backplanes; Glass; Integrated circuits; Metals; Silicon; Substrates; Assembly; OLEDs; backplanes; displays; printed electronics; transfer-printing;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2011.2128324