Title :
The 77-K Stress and Strain Dependence of the Critical Current of YBCO Coated Conductors and Lap Joints
Author :
Walsh, R.P. ; McRae, D. ; Markiewicz, W.D. ; Lu, J. ; Toplosky, V.J.
Author_Institution :
Nat. High Magn. Field Lab., Florida State Univ., Tallahassee, FL, USA
Abstract :
The electromechanical performance of commercially available YBCO high-temperature superconductor (HTS) is characterized in support of the 32T all-superconducting magnet program at the National High Magnetic Field Laboratory. Accurate characterization of the HTS coated conductors mechanical properties are essential for the aggressive high-field magnet design. Here, we report the 77-K stress-strain behavior of a series of conductors with varying thickness coatings of copper. The electromechanical performance of the conductors is determined in tests to measure the critical current as a function of applied axial strain, at 77-K in self field. Available conductor lengths necessitate a magnet design with soldered lap joints and the subsequent evaluation the lap joint performance reported here. Reports of low transverse strength and conductor delamination due transverse ( c-axis) tensile stress prompted tests to measure the conductors´ electrical performance in the presence of transverse stress that are also reported.
Keywords :
barium compounds; critical currents; delamination; electrical conductivity; electromechanical effects; high-temperature superconductors; stress-strain relations; yttrium compounds; YBCO; critical current; delamination; electrical conductivity; electrical property; electromechanical property; high-temperature superconductor; lap joints; national high magnetic field laboratory; strain dependence; stress dependence; stress-strain relations; temperature 77 K; tensile stress; transverse strength; Conductors; Copper; Integrated circuits; Joints; Strain; Stress; Superconducting magnets; Axial strain; YBCO coated conductor; critical current density; super conducting magnets; tensile stress;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2011.2182349