DocumentCode
141263
Title
Ambulatory measurement of foot kinematics using wearable ultrasonic sensors
Author
Yongbin Qi ; Cheong Boon Soh ; Gunawan, Erry ; Kay-Soon Low
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear
2014
fDate
26-30 Aug. 2014
Firstpage
6282
Lastpage
6285
Abstract
In this paper, an ultrasonic-based system for foot parameters measurement has been proposed and investigated. An extended Kalman filtering-based methodology has been developed to extract foot parameters including step length, stride length and cycle time from horizontal displacement during walking. The system comprises of one ultrasonic transmitter (mobile) and four ultrasonic receivers (anchors) with fixed known positions. A Radio Frequency (RF) module is used in our system not only to provide synchronization clock between the mobile and anchors, but also to transmit collected data wirelessly to reduce the wires used. To evaluate the performance of the proposed system, the 2-dimensional foot displacement and the foot parameters were measured and validated against the reference camera motion capture system. These experiment results demonstrate the capability of the proposed system being used as a gait analysis tool for rehabilitation and other medical applications.
Keywords
Kalman filters; biomedical measurement; gait analysis; kinematics; patient rehabilitation; ultrasonic devices; 2D foot displacement; ambulatory measurement; cycle time; extended Kalman filtering method; fixed known positions; foot kinematics; foot parameters measurement; gait analysis tool; horizontal displacement; motion capture system; radio frequency module; step length; stride length; ultrasonic receivers; ultrasonic transmitter; walking; wearable ultrasonic sensors; Acoustics; Cameras; Foot; Legged locomotion; Mobile communication; Sensors; Ultrasonic variables measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2014.6945065
Filename
6945065
Link To Document