DocumentCode :
141359
Title :
Implanted electrodes for multi-month EEG
Author :
Jochum, Thomas ; Engdahl, Susannah ; Kolls, Brad J. ; Wolf, Philip
Author_Institution :
Duke Univ., Durham, NC, USA
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
6543
Lastpage :
6548
Abstract :
An implanted electroencephalogram (EEG) recorder would help diagnose infrequent seizure-like events. A proof-of-concept study quantified the electrical characteristics of the electrodes planned for the proposed recorder. The electrodes were implanted in an ovine model for eight weeks. Electrode impedance was less than 800 Ohms throughout the study. A frequency-domain determination of sedation performed similarly for surface versus implanted electrodes throughout the study. The time-domain correlation between an implanted electrode and a surface electrode was almost as high as between two surface electrodes (0.86 versus 0.92). EEG-certified clinicians judged that the implanted electrode quality was adequate to excellent and that the implanted electrodes provided the same clinical information as surface electrodes except for a noticeable amplitude difference. No significant issues were found that would stop development of the EEG recorder.
Keywords :
biomedical electrodes; electroencephalography; frequency-domain analysis; medical disorders; neurophysiology; prosthetics; time-domain analysis; EEG recorder; EEG-certified clinicians; amplitude difference; clinical information; electrode electrical characteristics; electrode impedance; frequency-domain determination; implanted electrode quality; implanted electroencephalogram recorder; infrequent seizure-like events; multimonth EEG; ovine model; proof-of-concept study; resistance 800 ohm; sedation; surface electrode; time-domain correlation; Assembly; Correlation; Electrodes; Electroencephalography; Impedance; Spectrogram; Surface impedance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6945127
Filename :
6945127
Link To Document :
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