DocumentCode :
141366
Title :
Characterization of ionic permeability and water vapor transmission rate of polymers used for implantable electronics
Author :
Kirsten, Sabine ; Schubert, Martin ; Uhlemann, Jurgen ; Wolter, Klaus-Jurgen
Author_Institution :
Electron. Packaging Lab. Dresden, Tech. Univ. Dresden, Dresden, Germany
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
6561
Lastpage :
6564
Abstract :
Biocompatible polymers used as encapsulation and packaging materials for implantable electronic devices have to comply with numerous requirements. Especially their barrier properties against water molecules and ions are of particular interest regarding the reliability of the encapsulation as well as functional integrity of the electronic components since water and ions on the circuit board may evoke corrosion, leakage current and finally the failure of the device. This paper describes a measurement setup to investigate the ionic permeability under in vitro conditions of polymeric membranes manufactured from various biocompatible polymers. Ionic permeability and water vapor transmission rate representing the barrier properties of these membranes were investigated. First results were obtained for polyimide, silicone, polyether ether ketone and polyamide, whereas polyimide evinced the best properties.
Keywords :
biomedical electronics; biomedical materials; corrosion; encapsulation; membranes; permeability; polymers; prosthetics; silicones; water; barrier properties; biocompatible polymers; circuit board; device failure; electronic components; encapsulation reliability; evoke corrosion; functional integrity; implantable electronic devices; in vitro conditions; ionic permeability characterization; leakage current; measurement setup; packaging materials; polyamide; polyether ether ketone; polyimide; polymeric membranes; silicone; water molecules; water vapor transmission rate; Encapsulation; Permeability; Permeability measurement; Plastics; Pollution measurement; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6945131
Filename :
6945131
Link To Document :
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