Title :
Flexible intramuscular micro tube electrode combining electrical and chemical interface
Author :
Hong-Chang Tian ; Jing-Quan Liu ; Jing-Cheng Du ; Xiao-Yang Kang ; Chuan Zhang ; Bin Yang ; Xiang Chen ; Chun-Sheng Yang
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
With the rapidly developed micromachining technology, various kinds of sophisticated microelectrodes integrated with micro fluidic channels are design and fabricated for not only electrophysiological recording and stimulation, but also chemical drug delivery. As many efforts have been devoted to develop rigid microprobes for neural research of brain, few researchers concentrate on fabrication of flexible microelectrodes for intramuscular electrophysiology and chemical interfacing. Since crude wire electrodes still prevail in functional electrical stimulation (FES) and electromyography (EMG) recording of muscle, here we introduce a flexible micro tube electrode combining electrical and chemical pathway. The proposed micro tube electrode is manufactured based on polymer capillary, which provide circumferential electrode site contacting with electro-active tissue and is easy to manufactured with low cost.
Keywords :
biomedical electrodes; biomedical materials; drug delivery systems; electromyography; flexible structures; microchannel flow; micromachining; neurophysiology; polymers; EMG; FES; brain; chemical drug delivery; chemical interface; chemical interfacing; chemical pathway; electrical interface; electrical pathway; electrophysiological recording; flexible intramuscular microtube electrode; flexible microelectrodes; functional electrical stimulation; intramuscular electrophysiology; lectromyography; microfluidic channels; micromachining; polymer capillary; Drug delivery; Electric potential; Electrical resistance measurement; Electrodes; Electromyography; Electron tubes; Polymers;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
DOI :
10.1109/EMBC.2014.6945226