Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven

Author

Pavuluri, Sumanth Kumar ; Ferenets, Marju ; Goussetis, George ; Desmulliez, Marc P Y ; Tilford, Tim ; Adamietz, Raphael ; Muller, Gunter ; Eicher, Frank ; Bailey, Chris

Author_Institution

Microsyst. Eng. Centre, Heriot-Watt Univ., Edinburgh, UK

Volume

2

Issue

5

fYear

2012

fDate

5/1/2012 12:00:00 AM

Firstpage

799

Lastpage

806

Abstract

An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated in the microwave head of the oven. An automatic computer-controlled closed feedback loop has been used to measure the temperature in the curing material and modulate the system operating power to obtain predefined curing temperature cycles for efficient curing. Uniform curing of the encapsulant material is achieved with typical cure time of ~300s with a ramp rate of 1.66°C/s and a hold period of ~100s . Differential scanning calorimeter based measurement for the curing of the polymer dielectric indicates a near 100% degree of cure.

Keywords

curing; differential scanning calorimetry; encapsulation; microwave ovens; polymers; temperature measurement; automatic computer-controlled closed feedback loop; curing material; curing temperature cycle; differential scanning calorimeter; encapsulation material; infrared pyrometer; microelectronic component; open-ended microwave oven; polymer dielectric; real-time measurement; temperature measurement; Curing; Electromagnetic heating; Materials; Microwave ovens; Microwave theory and techniques; Temperature measurement; Electromagnetic heating; encapsulation; packaging;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2011.2177524

Filename

6122494