DocumentCode
1415867
Title
HfSiO Bulk Trap Density Controls the Initial
in nMOSFETs
Author
Sahhaf, Sahar ; Degraeve, Robin ; Srividya, V. ; De Brabanter, Kris ; Schram, Tom ; Gilbert, M. ; Vandervorst, Wilfried ; Groeseneken, Guido
Author_Institution
Interuniv. Microelectron. Center, Leuven, Belgium
Volume
12
Issue
2
fYear
2012
fDate
6/1/2012 12:00:00 AM
Firstpage
323
Lastpage
334
Abstract
The underlying physical mechanism of the Vth adjustment of nMOSFETs with HfSiO/TiN gate stack obtained by As and Ar implantation is investigated. It is experimentally proved that the trapped charge in the HfSiO bulk defects controls the initial Vth value in nMOSFETs. The reduction of the charged trap density in HfSiO by implant explains the tuned Vth values.
Keywords
MOSFET; hafnium compounds; HfSiO; bulk defects; bulk trap density; charged trap density; nMOSFET; Argon; Dielectrics; Electron traps; High K dielectric materials; Implants; Logic gates; Metals; $V_{rm fb}$ ; HfSiO bulk defect density; initial $V_{rm th}$ ; reliability;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2012.2182997
Filename
6123203
Link To Document