DocumentCode
1415874
Title
Solder thickness variation with respect to soldering parameters
Author
Lin, Kwang-Lung ; Yao, Steven
Author_Institution
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Volume
23
Issue
4
fYear
2000
fDate
12/1/2000 12:00:00 AM
Firstpage
661
Lastpage
664
Abstract
This study investigated the growth behavior of solder interconnect on solder bonding pad. The solder thickness was investigated with respect to parameters including bonding pad area, reflow temperature, solder paste volume, loading, and die size (metallization area). Solder thickness was found to have a maximum value with respect to the ratio of solder paste volume to pad size. Loading and the reflow temperature showed no effect on solder thickness. An enlargement in metallization area reduces the solder thickness, while greater solder paste volume increases the solder thickness
Keywords
integrated circuit packaging; lead bonding; reflow soldering; bonding pad area; die size; growth behavior; loading; metallization area; reflow temperature; solder paste volume; solder thickness variation; soldering parameters; Bonding; Furnaces; Materials science and technology; Metallization; Photodiodes; Rectifiers; Shape; Soldering; Substrates; Temperature;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.888850
Filename
888850
Link To Document