Title :
Prediction of paddle shift via 3-D TSOP modeling
Author :
Su, Francis ; Hwang, Sheng-Jye ; Lee, Huei-Huang ; Huang, Durn-Yuan
Author_Institution :
Dept. of Package Dev., ChipMOS Technol. Inc., Tainan, Taiwan
fDate :
12/1/2000 12:00:00 AM
Abstract :
This study develops a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during molding through the help of a true three-dimensional (3-D) Computational Fluid Dynamics (CFD) software
Keywords :
computational fluid dynamics; electronic design automation; integrated circuit design; integrated circuit modelling; integrated circuit packaging; moulding; 3D TSOP modeling; Computational Fluid Dynamics; molding process; paddle shift; pressure difference; thin small outline packages; viscous stress; Computational fluid dynamics; Computational modeling; Connectors; Electromagnetic compatibility; Integrated circuit packaging; Manufacturing processes; Predictive models; Software packages; Stress; Wires;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.888854
