Circuit board inspection using a range camera

Author

Snyder, Wesley E. ; Hsiao, Meng-ling ; Overton, Kenneth J. ; Boone, Katherine E.

Author_Institution

Center for Commun. & Signal Process., North Carolina State Univ., Raleigh, NC, USA

Volume

38

Issue

2

fYear

1991

fDate

4/1/1991 12:00:00 AM

Firstpage

142

Lastpage

149

Abstract

A high-speed, high-accuracy three-dimensional (3-D) range camera that possesses sufficient speed and accuracy to inspect circuit boards in real time is presented. The architecture of the system is briefly described, and the algorithms used to make quantitative presolder measurements, including the orientations and lengths of leads and the locations and shapes of holes, are examined in detail. Since the unit runs in real time and performs sophisticated image analysis functions, considerable emphasis in the algorithm development was placed on the ability to partition tasks between general-purpose computers and array processors

Keywords

cameras; computer vision; inspection; printed circuit manufacture; printed circuit testing; spatial variables measurement; 3-D; algorithm development; array processors; circuit board inspection; computers; high-accuracy; high-speed; hole location; lead length; lead orientation; quantitative presolder measurements; range camera; real time; shape location; three-dimensional; Cameras; Image analysis; Inspection; Lead; Length measurement; Partitioning algorithms; Performance analysis; Printed circuits; Shape measurement; Wiring;

fLanguage

English

Journal_Title

Industrial Electronics, IEEE Transactions on

Publisher

ieee

ISSN

0278-0046

Type

jour

DOI

10.1109/41.88908

Filename

88908