DocumentCode :
1416513
Title :
Simplified simulations of GaAs MESFET´s with semi-insulating substrate compensated by deep levels
Author :
Horio, Kazushige ; Fuseya, Yasuji ; Kusuki, Hiroyuki ; Yanai, Hisayoshi
Author_Institution :
Dept. of Electr. Eng., Shibaura Inst. of Technol., Tokyo, Japan
Volume :
10
Issue :
10
fYear :
1991
fDate :
10/1/1991 12:00:00 AM
Firstpage :
1295
Lastpage :
1302
Abstract :
Current-voltage characteristics of GaAs MESFETs (with p-butter layers) on semi-insulating substrates compensated by deep levels are simulated by two-carrier and one-carrier models. For a thicker p-buffer layer or for higher acceptor density in the substrate, the drain current becomes lower because the substrate current is reduced. The one-carrier model also gives reasonable results for a case with a hole-trap substrate. Small-signal parameters of GaAs MESFETs on various types of substrates are also simulated. For a thicker p-buffer layer or for higher acceptor densities in the semi-insulating substrates, the substrate current is reduced, and both transconductance and cutoff frequency become higher. It is concluded that, to utilize the high-speed and high-frequency performance of GaAs MESFETs, acceptor densities in the substrate should be made high
Keywords :
III-V semiconductors; Schottky gate field effect transistors; deep levels; gallium arsenide; semiconductor device models; substrates; GaAs; I-V characteristics; MESFETs; SI substrate; acceptor density; cutoff frequency; deep levels compensation; high-frequency performance; high-speed; hole-trap substrate; one-carrier models; p-butter layers; semi-insulating substrate; small-signal parameters; transconductance; two-carrier models; Charge carrier processes; Cutoff frequency; Dielectric substrates; Electron emission; Energy states; FETs; Gallium arsenide; MESFET integrated circuits; Transconductance; Voltage;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.88925
Filename :
88925
Link To Document :
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