DocumentCode
1416590
Title
Investigation of Temperature-Dependent High-Frequency Noise Characteristics for Deep-Submicrometer Bulk and SOI MOSFETs
Author
Wang, Sheng-Chun ; Su, Pin ; Chen, Kun-Ming ; Chen, Bo-Yuan ; Huang, Guo-Wei
Author_Institution
Dept. of Electron. Eng. & the Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
59
Issue
3
fYear
2012
fDate
3/1/2012 12:00:00 AM
Firstpage
551
Lastpage
556
Abstract
The temperature dependence of high-frequency noise characteristics for deep-submicrometer bulk and silicon-on-insulator (SOI) MOSFETs has been experimentally examined in this paper. With the downscaling of the channel length, our paper indicates that the power spectral density of the channel noise (Sid) of the bulk MOSFET becomes less sensitive to temperature due to the smaller degradation of the channel conductance at zero drain bias gd0 as temperature rises. We also show that the SOI-specific floating-body and self-heating effects would result in higher white-noise gamma factor. Finally, for both the bulk and SOI MOSFETs, since transconductance gm significantly decreases as temperature increases, their minimum noise figure NFmin and equivalent noise resistance Rn would degrade with increasing temperature.
Keywords
MOSFET; heating; semiconductor device noise; silicon-on-insulator; SOI MOSFET; channel conductance; channel length downscaling; channel noise; deep submicrometer bulk MOSFET; floating body effect; power spectral density; self heating effect; silicon-on-insulator MOSFET; temperature dependent high frequency noise; transconductance; Integrated circuit modeling; MOSFETs; Noise; Radio frequency; Temperature; Temperature dependence; High frequency; MOSFET; noise; temperature dependence; van der Ziel´s model;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2011.2177664
Filename
6125244
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