• DocumentCode
    1416846
  • Title

    Comparison of dielectric properties between epoxy composites with nanosized clay fillers modified by primary amine and tertiary amine

  • Author

    Tagami, N. ; Hyuga, M. ; Ohki, Y. ; Tanaka, T. ; Imai, T. ; Harada, M. ; Ochi, M.

  • Author_Institution
    Dept. of Electr. Eng. & Biosci., Waseda Univ., Tokyo, Japan
  • Volume
    17
  • Issue
    1
  • fYear
    2010
  • fDate
    2/1/2010 12:00:00 AM
  • Firstpage
    214
  • Lastpage
    220
  • Abstract
    Epoxy-based nanocomposites (NCs) were prepared using clay modified by either primary amine or tertiary amine, and the effect of the difference in modifier on the thermal and dielectric properties of the NCs were discussed. The NC with clay fillers modified by the primary amine, 1C, shows a glass transition end temperature (Teg) at a temperature 20°C lower than the neat epoxy (N). This indicates that the resin of 1C is less crosslinked than that of N. On the other hand, the sample 3C, in which the clay was modified by the tertiary amine, shows a DSC spectrum close to that of N. Namely, 3C has a high crosslinking density similar to N. While the three samples show a relaxation peak in their dielectric loss spectra, the peak appears at high frequencies in 1C compared to N and 3C. Moreover, ionic conduction current flows more at high temperatures in 1C than in N or 3C. These facts are ascribable to the difference in their crosslinking densities.
  • Keywords
    clay; composite insulating materials; dielectric losses; dielectric materials; dielectric relaxation; differential scanning calorimetry; filled polymers; glass transition; ionic conductivity; nanocomposites; DSC spectrum; dielectric loss spectra; dielectric properties; dielectric relaxation; epoxy composite; glass transition end temperature; ionic conduction current; nanocomposite; nanosized clay fillers; primary amine modified clay; resin crosslinking density; tertiary amine modified clay; thermal properties; Chemistry; Dielectric losses; Dielectric materials; Electrical products industry; Epoxy resins; Nanocomposites; Polymers; Production systems; Research and development; Temperature; DSC; Epoxy nanocomposite; clay modifier; complex permittivity; dielectric properties; electric conduction;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2010.5412020
  • Filename
    5412020