DocumentCode
1418131
Title
Reset Instability in
:Cu/Pt RRAM Device
Author
Li, Yingtao ; Long, Shibing ; Lv, Hangbing ; Liu, Qi ; Wang, Wei ; Wang, Qin ; Huo, Zongliang ; Wang, Yan ; Zhang, Sen ; Liu, Su ; Liu, Ming
Author_Institution
Lab. of Nano-Fabrication & Novel Devices Integrated Technol., Chinese Acad. of Sci., Beijing, China
Volume
32
Issue
3
fYear
2011
fDate
3/1/2011 12:00:00 AM
Firstpage
363
Lastpage
365
Abstract
The metal oxide solid electrolyte-based RRAM device is a promising candidate for post-Flash nonvolatile memories. The critical operation of such a device is the reset process, and the reliability study of the reset process and its physical understanding are important to RRAM development. This letter reports the observation of the unstable reset behavior in the -based solid electrolyte RRAM. During the reset process, the LRS resistance of the device will first reduce and then increase to reach the HRS. It is also seen that (i.e., the voltage at which a decrease of takes place) decreases with an increase of . This instability might be attributed to the subsequent growth of the filament after the energy barrier is reached to overcome electrochemical reactions during the reset process. Based on these experimental results, a physical model is developed to help explain the dependence of on , which provides an important guideline to the optimization of RRAM operations.
Keywords
MIM devices; copper; electrochemistry; platinum; random-access storage; solid electrolytes; zirconium compounds; Cu-ZrO2:Cu-Pt; electrochemical reactions; metal oxide solid electrolyte-based RRAM device; post Flash nonvolatile memories; reset instability; reset process reliability; Model; reset instability; resistance random access memory; resistive random access memory (RRAM);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2010.2095822
Filename
5680579
Link To Document