DocumentCode :
1418131
Title :
Reset Instability in \\hbox {Cu}/\\hbox {ZrO}_{2} :Cu/Pt RRAM Device
Author :
Li, Yingtao ; Long, Shibing ; Lv, Hangbing ; Liu, Qi ; Wang, Wei ; Wang, Qin ; Huo, Zongliang ; Wang, Yan ; Zhang, Sen ; Liu, Su ; Liu, Ming
Author_Institution :
Lab. of Nano-Fabrication & Novel Devices Integrated Technol., Chinese Acad. of Sci., Beijing, China
Volume :
32
Issue :
3
fYear :
2011
fDate :
3/1/2011 12:00:00 AM
Firstpage :
363
Lastpage :
365
Abstract :
The metal oxide solid electrolyte-based RRAM device is a promising candidate for post-Flash nonvolatile memories. The critical operation of such a device is the reset process, and the reliability study of the reset process and its physical understanding are important to RRAM development. This letter reports the observation of the unstable reset behavior in the -based solid electrolyte RRAM. During the reset process, the LRS resistance of the device will first reduce and then increase to reach the HRS. It is also seen that (i.e., the voltage at which a decrease of takes place) decreases with an increase of . This instability might be attributed to the subsequent growth of the filament after the energy barrier is reached to overcome electrochemical reactions during the reset process. Based on these experimental results, a physical model is developed to help explain the dependence of on , which provides an important guideline to the optimization of RRAM operations.
Keywords :
MIM devices; copper; electrochemistry; platinum; random-access storage; solid electrolytes; zirconium compounds; Cu-ZrO2:Cu-Pt; electrochemical reactions; metal oxide solid electrolyte-based RRAM device; post Flash nonvolatile memories; reset instability; reset process reliability; Model; reset instability; resistance random access memory; resistive random access memory (RRAM);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2010.2095822
Filename :
5680579
Link To Document :
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