DocumentCode
1418518
Title
Integral-Equation Equivalent-Circuit Method for Modeling of Noise Coupling in Multilayered Power Distribution Networks
Author
Wei, Xing-Chang ; Li, Er-Ping
Author_Institution
Comput. Electron. & Photonics Dept., A*STAR Inst. of High Performance Comput., Singapore, Singapore
Volume
58
Issue
3
fYear
2010
fDate
3/1/2010 12:00:00 AM
Firstpage
559
Lastpage
565
Abstract
Power distribution networks are the major source of noise coupling in high-speed and high-density electronic packages and printed circuit boards. We present the integral equation hybrid with the modal decoupling as a simple and efficient method for the modeling of multilayered power distribution networks. In this method, the power distribution network is decoupled into three simple parts: power-ground planes, signal traces, and multihole vias. For the through-hole vias, we propose a nonequipotential transmission lines model to represent their parasitic circuits. An accurate and efficient de-embedding method is used to extract the parameters inside the models. It accounts for losses and irregular shapes of substrates and conductors. Finally, the equivalent circuits of each part of power distribution network are integrated to perform the system-level signal and power integrity analysis. The accuracy and efficiency of the proposed method are validated through comparison with the measurement and full-wave analysis.
Keywords
circuit noise; coupled circuits; electronics packaging; equivalent circuits; integral equations; printed circuits; transmission lines; efficient deembedding method; full-wave analysis; high-density electronic packages; high-speed electronic packages; integral-equation equivalent-circuit method; modal decoupling; multilayered power distribution networks; noise coupling modelling; nonequipotential transmission lines model; parasitic circuits; power integrity analysis; power-ground planes; printed circuit boards; signal traces; system-level signal; De-embedding method; equivalent-circuit model; integral equation; power-ground planes; signal and power integrity; through-hole vias;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2010.2040405
Filename
5415531
Link To Document