• DocumentCode
    141902
  • Title

    Directions in future of SRAM with QDR-WideIO for high performance networking applications and beyond

  • Author

    Keshavarzi, Ali ; Maheshwari, Dinesh ; Mattos, Derwin ; Kapre, Ravi ; Krishnegowda, Sandeep ; Whately, Morgan ; Gopalswamy, Sudhir

  • Author_Institution
    Cypress Semicond., San Jose, CA, USA
  • fYear
    2014
  • fDate
    15-17 Sept. 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper we describe the high performance synchronous QDR-WideIO SRAM KGD from Cypress that is architected with fast and wide interface with optimized memory sub-system for future high performance networking and computing applications. Systems for next generation networking switches rely on high rate router line cards of 200 to 400 Gbps. QDR-WideIO fabricated on 28nm HKMG technology builds upon High Bandwidth Memory (HBM) interface standard while using 2.5D/3D stacking to form a System in Package (SiP) networking system solutions. We explain that both SRAM and DRAM are necessary and can co-exist in these systems and why it does not make sense to integrate the SRAM inside the logic ASIC. We also describe the memory design and partitioning that allows for delivering requisite Random Transaction Rate (RTR) representing random accesses to the memory per second of approaching 24000 MT/s (>10X improvement over our previous generation of QDR-IV synchronous SRAM) and total bandwidth of greater than 1.5 Tbps in a power efficient way. QDR-WideIO achieves latency of 13 cycles for read and 8 cycles for write with density of 288Mb with core operating at 1500 MHz. Finally we describe a path forward toward future of in-package integrated products.
  • Keywords
    DRAM chips; SRAM chips; application specific integrated circuits; system-in-package; 2.5D-3D stacking; Cypress; DRAM; HBM; HKMG technology; QDR-IV synchronous SRAM; RTR; SRAM KGD; SiP; frequency 1500 MHz; high bandwidth memory; high performance networking applications; high performance synchronous QDR-WideIO; logic ASIC; next generation networking; optimized memory sub-system; random transaction rate; size 28 nm; storage capacity 288 Mbit; system in package; Error correction codes; Market research; Memory management; Ports (Computers); Random access memory; Stacking; 2.5D; 3D; 400Gbps; Communication; Computing; Ethernet; HBM; HPC; KGD; Networking; QDR; SRAM; Servers; SiP; SoC; Synchronous; WideIO;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2014 IEEE Proceedings of the
  • Conference_Location
    San Jose, CA
  • Type

    conf

  • DOI
    10.1109/CICC.2014.6946029
  • Filename
    6946029