• DocumentCode
    1419238
  • Title

    Plugging the global power leak [appliance standby mode power reduction]

  • Author

    Wacyk, Lhor ; Giannopoulos, Demetri ; Mukherjee, Satyen

  • Author_Institution
    Philips Res., North American Philips Corp., Briarcliff Manor, NY, USA
  • Volume
    46
  • Issue
    6
  • fYear
    2000
  • fDate
    11/1/2000 12:00:00 AM
  • Firstpage
    23
  • Lastpage
    27
  • Abstract
    Standby mode is a convenient but extremely wasteful feature of many electronics products. The authors describe how the GreenChip family is helping to produce a more environmentally friendly switched mode power supply. The new ICs implement an extensive set of power management functions focused on improving the efficiency of the standard flyback supply in standby mode. They achieve this by introducing three special modes of operation, referred to as burst-mode, off-mode and low-frequency mode. Use of GreenChip devices can typically reduce standby power to 2-3 W, and for a slight increase in cost this can be brought down to less than 500 mW. Along with these green features, the ICs have been designed to simplify the design task and reduce the component count, thereby addressing environmental concerns while reducing overall product costs. A new development in high-voltage IC technology based on a thin-layer silicon-on-insulator (SOI) process has been announced by Philips Semiconductors. This technology, known as EZ-HV-SOI, is expected to allow significant improvements and enhancements in the next generation of GreenChip controllers
  • Keywords
    domestic appliances; energy conservation; power integrated circuits; silicon-on-insulator; switched mode power supplies; EZ-HV-SOI; GreenChip; Philips Semiconductors; burst-mode operation; component count reduction; domestic appliances; efficiency improvement; environmentally friendly; high-voltage IC technology; low-frequency mode operation; off-mode operation; power management functions; standard flyback supply; standby mode power reduction; switched mode power supply; thin-layer silicon-on-insulator;
  • fLanguage
    English
  • Journal_Title
    IEE Review
  • Publisher
    iet
  • ISSN
    0953-5683
  • Type

    jour

  • DOI
    10.1049/ir:20000608
  • Filename
    891965