Title :
Ion beam effect on Ge-Se chalcogenide glass films: Non-volatile memory array formation, structural changes and device performance
Author :
Latif, Muhammad Rizwan ; Nichol, T.L. ; Mitkova, M. ; Tenne, Dmitri A. ; Csarnovics, Istvan ; Kokenyesi, S. ; Csik, Arpad
Author_Institution :
Dept. of Electr. & Comput. Eng., Boise State Univ., Boise, ID, USA
Abstract :
In this work a scheme for fabricating a conductive bridge non-volatile memory arrays, using ion bombardment through a mask, is demonstrated. Blanket films and devices have been created to study the structural changes, surface roughness and device performance. Ar+ ions interaction on thin films of GexSe1-x system have been studied using Raman Spectroscopy, Atomic Force Microscopy (AFM) and Energy Dispersive X-Ray Spectroscopy (EDS). The performance of the memory devices has been analyzed based on the formation of vias and damage accumulation due to Ar+ ion interactions with GexSe1-x(x=0.25, 0.3 and 0.4) thin films of chalcogenide glasses (ChG). This method of devices/arrays fabrication provides a unique alternative to conventional photolithography for prototyping redox conductive bridge memory without involving any wet chemistry.
Keywords :
Ge-Si alloys; Raman spectroscopy; atomic force microscopy; chalcogenide glasses; ion beam effects; random-access storage; surface roughness; AFM; Ge-Se chalcogenide glass films; GexSe1-x; Raman spectroscopy; atomic force microscopy; blanket films; chalcogenide glasses; conductive bridge nonvolatile memory arrays; damage accumulation; device performance; energy dispersive X-ray spectroscopy; ion beam effect; ion bombardment; memory devices; nonvolatile memory array formation; photolithography; redox conductive bridge memory; structural changes; surface roughness; thin films; via formation; Arrays; Films; Glass; Performance evaluation; Rough surfaces; Surface morphology; Surface roughness; Redox conductive bridge memory; chalcogenide glass; film and device characterization;
Conference_Titel :
Microelectronics And Electron Devices (WMED), 2014 IEEE Workshop On
Conference_Location :
Boise, ID
Print_ISBN :
978-1-4799-2222-2
DOI :
10.1109/WMED.2014.6818720