Title :
A mm-sized implantable device with ultrasonic energy transfer and RF data uplink for high-power applications
Author :
Charthad, Jayant ; Weber, Marcus J. ; Ting Chia Chang ; Saadat, Mahmoud ; Arbabian, Amin
Author_Institution :
Stanford Univ., Stanford, CA, USA
Abstract :
A first proof-of-concept mm-sized implant based on ultrasonic power transfer and RF uplink data transmission is presented. The prototype consists of a 1 mm × 1 mm piezoelectric receiver, a 1 mm × 2 mm chip designed in 65 nm CMOS and a 2.5 mm × 2.5 mm off-chip antenna, and operates through 3 cm of chicken meat which emulates human tissue. The implant supports a DC load power of 100 μW allowing for high-power applications. It also transmits consecutive UWB pulse sequences activated by the ultrasonic downlink data path, demonstrating sufficient power for an Mary PPM transmitter in uplink.
Keywords :
CMOS integrated circuits; antennas; inductive power transmission; piezoelectric devices; prosthetics; ultrasonic waves; CMOS; DC load power; Mary PPM transmitter; RF data uplink; RF uplink data transmission; UWB pulse sequence; high-power applications; mm-sized implantable device; off-chip antenna; piezoelectric receiver; power 100 muW; size 1 mm; size 2 mm; size 2.5 mm; size 3 cm; size 65 nm; ultrasonic downlink data path; ultrasonic energy transfer; ultrasonic power transfer; Acoustics; Antenna measurements; Implants; Radio frequency; Receivers; Semiconductor device measurement; Voltage measurement; AC-DC power converters; Implantable biomedical devices; mm-sized implants; radio transmitters; ultrasonic power delivery;
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2014 IEEE Proceedings of the
Conference_Location :
San Jose, CA
DOI :
10.1109/CICC.2014.6946071
