Physically flexible high performance single crystal CMOS integrated with printed electronics

Flexible electronic systems have been limited by the ability to integrate IC functionality. Traditional silicon-based ICs are not flexible, and flexible transistors are too large and too slow to approach silicon-based IC density and performance. Transferring standard silicon IC wafers to polymer substrates addresses these limitations by transforming traditional ICs into a physically flexible form factor. Integrating these flexible ICs with printed electronics creates Flexible Hybrid Systems and enables a new generation of electronics.