DocumentCode
1420084
Title
Hot hole gate current in surface channel PMOSFETs
Author
Driussi, F. ; Esseni, D. ; Selmi, L. ; Piazza, F.
Author_Institution
DIEGM, Udine, Italy
Volume
22
Issue
1
fYear
2001
Firstpage
29
Lastpage
31
Abstract
This paper reports the observation of a new hot hole component of the gate current of p/sup +/-poly gate pMOS transistors. The phenomenon is characterized as a function of drain, gate, and substrate bias on devices featuring different oxide thickness and drain engineering options. The new hole gate current component is ascribed to injection into the oxide of substrate tertiary holes, generated by an impact ionization feedback mechanism similar to that responsible of CHannel Initiated Secondary ELectron injection (CHISEL) in nMOSFETs.
Keywords
MOSFET; hot carriers; impact ionisation; CHannel Initiated Secondary ELectron injection; drain bias; drain engineering options; gate bias; hot hole gate current; impact ionization feedback mechanism; oxide thickness; substrate bias; surface channel PMOSFETs; Channel hot electron injection; Charge carrier processes; Feedback; Helium; Hot carriers; Impact ionization; MOS devices; MOSFET circuits; Physics; Substrate hot electron injection;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.892434
Filename
892434
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