• DocumentCode
    1420084
  • Title

    Hot hole gate current in surface channel PMOSFETs

  • Author

    Driussi, F. ; Esseni, D. ; Selmi, L. ; Piazza, F.

  • Author_Institution
    DIEGM, Udine, Italy
  • Volume
    22
  • Issue
    1
  • fYear
    2001
  • Firstpage
    29
  • Lastpage
    31
  • Abstract
    This paper reports the observation of a new hot hole component of the gate current of p/sup +/-poly gate pMOS transistors. The phenomenon is characterized as a function of drain, gate, and substrate bias on devices featuring different oxide thickness and drain engineering options. The new hole gate current component is ascribed to injection into the oxide of substrate tertiary holes, generated by an impact ionization feedback mechanism similar to that responsible of CHannel Initiated Secondary ELectron injection (CHISEL) in nMOSFETs.
  • Keywords
    MOSFET; hot carriers; impact ionisation; CHannel Initiated Secondary ELectron injection; drain bias; drain engineering options; gate bias; hot hole gate current; impact ionization feedback mechanism; oxide thickness; substrate bias; surface channel PMOSFETs; Channel hot electron injection; Charge carrier processes; Feedback; Helium; Hot carriers; Impact ionization; MOS devices; MOSFET circuits; Physics; Substrate hot electron injection;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.892434
  • Filename
    892434