DocumentCode :
1420436
Title :
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
Author :
Harris, T. Robert ; Priyadarshi, Shivam ; Melamed, Samson ; Ortega, Carlos ; Manohar, Rajit ; Dooley, Steven R. ; Kriplani, Nikhil M. ; Davis, W. Rhett ; Franzon, Paul D. ; Steer, Michael B.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume :
2
Issue :
4
fYear :
2012
fDate :
4/1/2012 12:00:00 AM
Firstpage :
660
Lastpage :
667
Abstract :
A transient electrothermal simulation of a 3-D integrated circuit (3DIC) is reported that uses dynamic modeling of the thermal network and hierarchical electrothermal simulation. This is a practical alternative to full transistor electrothermal simulations that are computationally prohibitive. Simulations are compared to measurements for a token-generating asynchronous 3DIC clocking at a maximum frequency of 1 GHz. The electrical network is based on computationally efficient electrothermal macromodels of standard and custom cells. These are linked in a physically consistent manner with a detailed thermal network extracted from an OpenAccess layout file. Coupled with model-order reduction techniques, hierarchical dynamic electrothermal simulation of large 3DICs is shown to be tractable, yielding spatial and temporal selected transistor-level thermal profiles.
Keywords :
three-dimensional integrated circuits; transient analysis; transistor circuits; 3-D integrated circuit; dynamic modeling; frequency 1 GHz; hierarchical electrothermal simulation; thermal network; three-dimensional integrated circuits; token-generating asynchronous 3DIC; transient electrothermal analysis; transistor-level thermal profiles; Analytical models; Computational modeling; Heating; Integrated circuit modeling; Thermal analysis; Thermal resistance; Transient analysis; 3DIC; electrothermal effects; thermal management; transient analysis;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2011.2178414
Filename :
6129492
Link To Document :
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