• DocumentCode
    1421815
  • Title

    EMI-noise analysis under ASIC design environment

  • Author

    Hayashi, Sachio ; Yamada, Masaaki

  • Author_Institution
    Syst. LSI Design Div., Toshiba Corp., Kawasaki, Japan
  • Volume
    19
  • Issue
    11
  • fYear
    2000
  • fDate
    11/1/2000 12:00:00 AM
  • Firstpage
    1337
  • Lastpage
    1346
  • Abstract
    Electromagnetic compatibility (EMC) has become more and more important in designing electronic systems. Although electromagnetic radiation itself mainly occurs from off-chip conductors, the ultimate noise source is in LSI chips. Among the noise distribution paths, the power-line conducting noise is the most significant source of electromagnetic interference (EMI)-noise caused by LSIs. This paper introduces an EMI-noise analysis method suitable for application-specific integrated circuit design environment especially focusing on the power-line conducting noise. Modeling method for power network and switching activity, simulation flow, and experimental results are presented. Experimental results show that our modeling methodology estimates capacitance values with sufficient accuracy and reproduces the relative differences in EMI-noise levels
  • Keywords
    application specific integrated circuits; circuit CAD; circuit simulation; electromagnetic compatibility; electromagnetic interference; integrated circuit design; large scale integration; ASIC design environment; EMI-noise analysis; LSI chips; capacitance values; electromagnetic compatibility; integrated circuit design environment; noise distribution paths; noise source; power-line conducting noise; simulation flow; switching activity; Application specific integrated circuits; Circuit simulation; Conductors; Electromagnetic compatibility; Electromagnetic compatibility and interference; Electromagnetic interference; Electromagnetic radiation; Integrated circuit noise; Large scale integration; Working environment noise;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.892857
  • Filename
    892857