• DocumentCode
    1421829
  • Title

    Estimation of power dissipation using a novel power macromodeling technique

  • Author

    Chen, Zhanping ; Roy, Kaushik ; Chong, Edwin K.

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • Volume
    19
  • Issue
    11
  • fYear
    2000
  • fDate
    11/1/2000 12:00:00 AM
  • Firstpage
    1363
  • Lastpage
    1369
  • Abstract
    In this paper, we develop a novel technique based on Markov chains to accurately estimate power sensitivities to primary inputs in CMOS sequential circuits. A key application of power sensitivities is to construct a complicated power surface in the specification-space so as to easily obtain the power dissipation under any distribution of primary inputs, thereby offering an effective power macromodel for high-level power estimation. We demonstrate that such a power surface can be approximated by only a limited number of representative points. This benefit dramatically reduces the CPU and memory requirements. We have verified the feasibility and accuracy of the new technique to estimate power sensitivities on a large number of sequential benchmark circuits. Results on the power dissipation under different distributions of primary inputs demonstrate the efficiency and effectiveness of our power macromodeling technique
  • Keywords
    CMOS logic circuits; Markov processes; VLSI; high level synthesis; integrated circuit modelling; logic simulation; sequential circuits; CMOS sequential circuits; Markov chains; complicated power surface; high-level power estimation; power dissipation; power macromodel; power macromodeling technique; power sensitivities; primary inputs; representative points; sequential benchmark circuits; Central Processing Unit; Circuit simulation; Circuits and systems; Computational modeling; Portable computers; Power dissipation; Power system modeling; Probability; Sequential circuits; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.892859
  • Filename
    892859