Foreword contributions from the sixth topical meeting on electrical performance of electronic packaging

THE preceding list of eight papers have been selected from the 60 papers presented at the 6th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP´97, which was held in San Jose, CA, on October 27–29, 1997. Attendance was up 20% compared to the previous year which is a strong indication of the growing concern with electrical performance issues. The meeting had a truly international participation with presenters and attendees from Korea, Japan, Germany, Belgium, Spain, Austria, and Hungary. The technical sessions addressed the latest developments in power distribution, modeling of noise sources in package structures and interconnects, characterization techniques for both digital and microwave applications, and accelerated modeling and simulation methods. Very good presentations were given by participants from both industry and universities. Six invited talks from IBM, SUN, and Vienna University of Technology were spread over the three days.