DocumentCode :
1421994
Title :
[Back inside cover]
Volume :
21
Issue :
4
fYear :
1998
Abstract :
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher :
ieee
ISSN :
1083-4400
Type :
jour
DOI :
10.1109/TCPMC.1998.7102533
Filename :
7102533
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1421994
