DocumentCode
1422031
Title
An Accurate Two-Port De-Embedding Technique for RF/Millimeter-Wave Noise Characterization and Modeling of Deep Submicrometer Transistors
Author
Loo, Xi Sung ; Yeo, Kiat Seng ; Chew, Kok Wai J ; Chan, Lye Hock Kelvin ; Ong, Shih Ni ; Do, Manh Anh ; Boon, Chirn Chye
Author_Institution
Integrated Circuit (IC) Design Centre of Excellence, Nanyang Technol. Univ., Singapore, Singapore
Volume
59
Issue
2
fYear
2011
Firstpage
479
Lastpage
487
Abstract
An accurate and simple noise de-embedding technique is proposed for high-frequency noise characterization of transistors. It is demonstrated on 0.13-μm CMOS devices for up to 80 GHz. The proposed technique adopts a generalized two-port fixture model in conjunction with a set of shielded based structures, which enable simple de-embedding of fixture parasitic for up to the Metal 1 level. Unlike other methods, it is capable of simultaneously accounting for the parasitic effects of probe to pad contact impedances and metal finger parasitic while using only three dummy test structures. Also, it is designed to accommodate nonsymmetry between bond pad parasitic elements at two-port without consuming additional silicon area. This corresponds to a reduction in noise de-embedding error, which increases along the frequency domain (6% of NFmin at 80 GHz). Meanwhile, underestimation of metal finger parasitic by conventional techniques has lead to degradation in noise performance (NFmin) of 0.13-μm CMOS transistors by more than 3.5 dB at 80 GHz. Further validation results from extracted gate capacitance and transistor gain performance provide solid support to the proposed de-embedding technique.
Keywords
CMOS integrated circuits; MOSFET; field effect MIMIC; integrated circuit noise; semiconductor device noise; CMOS devices; CMOS transistors; RF-millimeter-wave noise characterization; bond pad parasitic elements; deep submicrometer transistors; dummy test structures; frequency 80 GHz; gate capacitance; generalized two-port fixture model; high-frequency noise characterization; metal finger parasitic; pad contact impedances; parasitic effects; probe contact impedances; shielded based structures; size 0.13 mum; transistor gain performance; two-port deembedding technique; Layout; MOSFETs; scattering parameters; semiconductor device noise;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2010.2097770
Filename
5682378
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