• DocumentCode
    1422845
  • Title

    Thermal-Electromechanical FEM–BEM Model for MEMS Resonator Simulation

  • Author

    Ekeom, Didace

  • Author_Institution
    Microsomes, St. Avertin, France
  • Volume
    20
  • Issue
    1
  • fYear
    2011
  • Firstpage
    184
  • Lastpage
    192
  • Abstract
    Minimization of dissipative losses is a major goal in microelectromechanical systems (MEMS) resonator design. For an accurate simulation of a MEMS resonator vibrating in a vacuum, thermoelastic damping phenomena related to irreversible heat dissipation induced by the coupling between heat transfer and strain rate during resonator vibration and acoustic radiation into the substrate have to be taken into account. The finite-element method (FEM) is suitable for structural simulation, particularly for thermoelastically damped structures vibrating in a vacuum. When the vibrating structure is deposited on an unbounded elastic medium, radiating conditions have to be taken into account. The boundary-element method (BEM) is suitable for simulation on an unbounded medium, and it is often used to complete the FEM. The goal of our paper is to develop and to validate a thermal-electromechanical FEM-BEM tool, which is helpful to predict and understand MEMS energy loss dissipation mechanisms.
  • Keywords
    boundary-elements methods; finite element analysis; micromechanical resonators; MEMS resonator simulation; acoustic radiation; boundary-element method; energy loss dissipation mechanisms; finite-element method; heat transfer; irreversible heat dissipation; microelectromechanical systems resonator; radiating conditions; resonator vibration; strain rate; structural simulation; thermal-electromechanical FEM-BEM Model; thermoelastically damped structures; unbounded elastic medium; $Q$-factor; Anchor loss; boundary-element method (BEM); finite-element method (FEM); microelectromechanical systems (MEMS) resonator; thermoelastic damping;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2010.2100021
  • Filename
    5685242