Title :
Micronetworking: reliable communication on 3D integrated circuits
Author :
Contreras, A.A. ; Moon, Todd K. ; Dasu, Aravind ; Gunther, Jacob H.
Author_Institution :
Micron Res. Center, Utah State Univ., Logan, UT, USA
Abstract :
A model is proposed to mitigate the communication problem in 3D integrated circuits caused by the breaks at the through-silicon vias (TSVs). Using a low-complexity network, the introduction of redundant TSVs makes it possible to reroute around breaks to maintain effective communication between layers.
Keywords :
circuit complexity; complex networks; elemental semiconductors; integrated circuit modelling; redundancy; silicon; three-dimensional integrated circuits; 3D integrated circuit communication model; Si; low-complexity network; micronetworking; redundant TSV; through-silicon vias;
Journal_Title :
Electronics Letters
DOI :
10.1049/el.2010.2193
