• DocumentCode
    1422912
  • Title

    Micronetworking: reliable communication on 3D integrated circuits

  • Author

    Contreras, A.A. ; Moon, Todd K. ; Dasu, Aravind ; Gunther, Jacob H.

  • Author_Institution
    Micron Res. Center, Utah State Univ., Logan, UT, USA
  • Volume
    46
  • Issue
    4
  • fYear
    2010
  • Firstpage
    291
  • Lastpage
    293
  • Abstract
    A model is proposed to mitigate the communication problem in 3D integrated circuits caused by the breaks at the through-silicon vias (TSVs). Using a low-complexity network, the introduction of redundant TSVs makes it possible to reroute around breaks to maintain effective communication between layers.
  • Keywords
    circuit complexity; complex networks; elemental semiconductors; integrated circuit modelling; redundancy; silicon; three-dimensional integrated circuits; 3D integrated circuit communication model; Si; low-complexity network; micronetworking; redundant TSV; through-silicon vias;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2010.2193
  • Filename
    5418561
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1422912