DocumentCode
14235
Title
Toward the World Smallest Wireless Sensor Nodes With Ultralow Power Consumption
Author
Jian Lu ; Okada, Hironao ; Itoh, Toshihiro ; Harada, Takeshi ; Maeda, Ryutaro
Author_Institution
Res. Center for Ubiquitous MEMS & Micro Eng., Tsukuba, Japan
Volume
14
Issue
6
fYear
2014
fDate
Jun-14
Firstpage
2035
Lastpage
2041
Abstract
Pursuit of the lowest size-limit of wireless sensor nodes may not only reduce power consumption and production cost, but also enables its layout-free ubiquitous applications, i.e., in our green sensor networks to compress energy consumption through visibility and optimization. In this paper, we engaged in developing the world smallest wireless sensor node with ultralow power consumption from both electrical block integration and physical interconnection points-of-view. A customized IC for signal processing and data transmission, which has universal interface to sensors and power management capability, was designed and then fabricated by using 0.18 μm 1.8 V/3.3 V 1P6M logic process. By introducing buried bump interconnection technology, we have successfully obtained one of the world´s smallest wireless sensor nodes, as small as 3.9 mm × 3.9 mm × 3.5 mm, for humidity and temperature monitoring. The sensor node also features an general purpose interface, available for analog and digital sensors, and the ultrasmall footprint of above sensor node enables its layout-free distribution or integration inside other remote sensing systems. Although the adopted antenna size was 2 cm × 5 cm, its flexibility enables free attach to any curved surfaces. Experimental results demonstrated that besides preferred ultralow power consumption and data transmission distance, configuration of above sensor nodes enables its easy assembly with stand-alone power source and flexible antenna for wide variety of applications.
Keywords
antennas; energy management systems; humidity sensors; integrated circuit interconnections; power consumption; signal processing; temperature sensors; wireless sensor networks; 1P6M logic process; analog sensor; buried bump interconnection technology; customized IC; data transmission; digital sensor; electrical block integration; energy consumption; flexible antenna; general purpose interface; green sensor network; humidity monitoring; layout-free distribution; layout-free integration; layout-free ubiquitous application; optimization; production cost; remote sensing system; signal processing; size 0.18 mum; temperature monitoring; ultralow power consumption; voltage 1.8 V; voltage 3.3 V; wireless sensor node; Integrated circuits; Prototypes; Sensor systems; Temperature sensors; Wireless communication; Wireless sensor networks; Integration; buried bump interconnection technology; integration; low power consumption; wireless sensor node;
fLanguage
English
Journal_Title
Sensors Journal, IEEE
Publisher
ieee
ISSN
1530-437X
Type
jour
DOI
10.1109/JSEN.2014.2309176
Filename
6750716
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