• DocumentCode
    1423714
  • Title

    Seeded Infiltration and Growth of Bulk YBCO Nano-Composites

  • Author

    Babu, N. Hari ; Shi, Yun-Hua ; Dennis, Anthony R. ; Pathak, Sandeep K. ; Cardwell, David A.

  • Author_Institution
    BCAST, Brunel Univ., Uxbridge, UK
  • Volume
    21
  • Issue
    3
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    2698
  • Lastpage
    2701
  • Abstract
    The seeded infiltration and growth (SIG) technique offers near-net shape processing of bulk superconductors with significant improvement in reduced Y2BaCuO5 (Y-211) inclusion size, reduced shrinkage, reduced porosity and improved current density compared to samples fabricated by top seeded melt growth (TSMG). Y2Ba4CuMOy phases where M = Nb, Mo, W, Ta, etc., have been shown to form nano-scale inclusions in the YBa2Cu3Oy (Y-123) phase matrix and to contribute to enhanced magnetic flux pinning in these materials. In this paper, we describe the introduction of Y2Ba4CuWOy nano-scale inclusions into bulk superconductors processed by the seeded infiltration growth process. Critical current density, Jc, in excess of 105 A/cm2 at 77 K in self-field is observed for samples containing Y2Ba4CuWOy.
  • Keywords
    critical current density (superconductivity); crystal growth; flux pinning; high-temperature superconductors; inclusions; melt infiltration; nanocomposites; porosity; yttrium compounds; SIG technique; Y-123 phase matrix; Y2BaCuO5; YBCO; YBa2Cu3Oy; bulk YBCO nanocomposites; critical current density; inclusion size; magnetic flux pinning; nanoscale inclusions; near-net shape processing; reduced porosity; reduced shrinkage; seeded infiltration and growth; top seeded melt growth; Critical current density; Magnetic liquids; Microstructure; Superconducting magnets; Yttrium barium copper oxide; Flux pinning; high temperature superconductors; melt-textured superconductors; nano-composites;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2010.2101574
  • Filename
    5685582