Integration and Packaging of a Macrochip With Silicon Nanophotonic Links

Author

Cunningham, John E. ; Krishnamoorthy, Ashok V. ; Ho, Ron ; Shubin, Ivan ; Thacker, Hiren ; Lexau, Jon ; Lee, Daniel C. ; Feng, Dazeng ; Chow, Eugene ; Luo, Ying ; Zheng, Xuezhe ; Li, Guoliang ; Yao, Jin ; Pinguet, Thierry ; Raj, Kannan ; Asghari, Mehdi ;

Author_Institution

Oracle Labs., San Diego, CA, USA

Volume

17

Issue

3

fYear

2011

Firstpage

546

Lastpage

558

Abstract

The technologies associated with integration and packaging have a significant impact on the overall system. In this paper, we review a silicon photonic “macrochip” system and its associated packaging that will allow dense wavelength-division multiplexed optical links to be intimately integrated and co-manufactured with the switching electronics. For this to happen, we anticipate a number of integration and packaging advances.

Keywords

electronics packaging; elemental semiconductors; integrated optics; nanophotonics; optical links; optical switches; silicon; wavelength division multiplexing; Si; dense wavelength-division multiplexed optical links; integrated optics; packaging; silicon photonic macrochip system; switching electronics; Arrays; Bridge circuits; Optical interconnections; Optical waveguides; Packaging; Silicon; Transistors; CMOS; computing; macrochip; nanophotonics; optical interconnects; routers; silicon photonics; switching; very large scale integration (VLSI);

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2010.2091674

Filename

5685655