• DocumentCode
    1424069
  • Title

    Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards

  • Author

    Wu, Songping ; Fan, Jun

  • Author_Institution
    Cisco Syst., Inc., San Jose, CA, USA
  • Volume
    54
  • Issue
    2
  • fYear
    2012
  • fDate
    4/1/2012 12:00:00 AM
  • Firstpage
    413
  • Lastpage
    420
  • Abstract
    Crosstalk among vias is a significant problem in high-speed multilayer printed circuit boards (PCBs), deteriorating signal quality and increasing jitter, especially when circuit density is high. In this paper, a two-step via crosstalk evaluation procedure is proposed. A fast approach for crosstalk estimation is developed for net screening as the first step. Then, more accurate but more time-consuming modeling can be performed for critical nets or the problematic nets identified in the screening. The main contribution of this study includes the analytical prediction of crosstalk among vias based on an infinite parallel-plane assumption. Its effectiveness and efficiency to predict the trends in the crosstalk among vias in practical PCB designs are demonstrated.
  • Keywords
    jitter; printed circuit design; vias; PCB design; analytical crosstalk prediction; circuit density; critical nets; high-speed multilayer printed circuit board; infinite parallel-plane assumption; jitter; problematic nets; signal quality; two-step via crosstalk evaluation; Crosstalk; Geometry; Impedance; Inductance; Integrated circuit modeling; Nonhomogeneous media; Transmission line matrix methods; Physics-based via circuit model; printed circuit board (PCB); signal integrity; via crosstalk; via models;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2011.2179658
  • Filename
    6132414