Title :
Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards
Author :
Wu, Songping ; Fan, Jun
Author_Institution :
Cisco Syst., Inc., San Jose, CA, USA
fDate :
4/1/2012 12:00:00 AM
Abstract :
Crosstalk among vias is a significant problem in high-speed multilayer printed circuit boards (PCBs), deteriorating signal quality and increasing jitter, especially when circuit density is high. In this paper, a two-step via crosstalk evaluation procedure is proposed. A fast approach for crosstalk estimation is developed for net screening as the first step. Then, more accurate but more time-consuming modeling can be performed for critical nets or the problematic nets identified in the screening. The main contribution of this study includes the analytical prediction of crosstalk among vias based on an infinite parallel-plane assumption. Its effectiveness and efficiency to predict the trends in the crosstalk among vias in practical PCB designs are demonstrated.
Keywords :
jitter; printed circuit design; vias; PCB design; analytical crosstalk prediction; circuit density; critical nets; high-speed multilayer printed circuit board; infinite parallel-plane assumption; jitter; problematic nets; signal quality; two-step via crosstalk evaluation; Crosstalk; Geometry; Impedance; Inductance; Integrated circuit modeling; Nonhomogeneous media; Transmission line matrix methods; Physics-based via circuit model; printed circuit board (PCB); signal integrity; via crosstalk; via models;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2011.2179658