• DocumentCode
    1424594
  • Title

    Processing and reliability of fast-flow, snap-cure underfills - Part I: processing and moisture sensitivity

  • Author

    Baldwin, Daniel F. ; Houston, Paul N.

  • Author_Institution
    Georgia Institute of Technology
  • Volume
    23
  • Issue
    4
  • fYear
    2000
  • fDate
    10/1/2000 12:00:00 AM
  • Firstpage
    235
  • Lastpage
    235
  • Keywords
    Assembly; Components, packaging, and manufacturing technology; Cranes; Electronic packaging thermal management; Electronics packaging; Flip chip; Industrial electronics; Materials reliability; Moisture; Testing;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2000.895055
  • Filename
    895055
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1424594