DocumentCode :
1424620
Title :
Burn-in effect on yield
Author :
Taeho Kim ; Way Kuo ; Wei-Ting Kary Chien
Author_Institution :
Korea Telecom
Volume :
23
Issue :
4
fYear :
2000
fDate :
10/1/2000 12:00:00 AM
Firstpage :
236
Lastpage :
236
Keywords :
Manufacturing industries; Performance analysis; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor devices; Shape; Substrates; Telecommunications;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2000.895059
Filename :
895059
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1424620
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