Innovative ESD thermoplastic composites structured through melt flow processing

Author

Narkis, Moshe ; Lidor, Gershon ; Vaxman, Anita ; Zuri, Limor

Author_Institution

Dept. of Chem. Eng., Technion-Israel Inst. of Technol., Haifa, Israel

Volume

23

Issue

4

fYear

2000

fDate

10/1/2000 12:00:00 AM

Firstpage

239

Lastpage

245

Abstract

The amount of carbon black required to impart electrical conductivity to an insulating polymer can be dramatically reduced by its selective localization in a multi-component system which includes the insulating polymer The present report describes property-structure relationships of polypropylene/nylon/glass fiber (PP/PA/GF) composites with consistent resistivity levels within the 10⁶-10⁹ ohms/sq range achieved at very low carbon black loadings (less than 2%). The quaternary composites studied structure spontaneously during the hot compounding/processing steps and have unique triple-percolation structures. The results were compared with typical carbon black filled materials, which usually contain 15 to 20 wt% carbon black and are too conductive to meet the 10⁶-10⁹ ohms/sq range

Keywords

conducting polymers; electrical conductivity; electrostatic discharge; filled polymers; glass fibre reinforced plastics; packaging; ESD thermoplastic composites; carbon black loadings; consistent resistivity levels; electrical conductivity; hot compounding/processing steps; insulating polymer; melt flow processing; multi-component system; polypropylene/nylon/glass fiber composites; selective localization; triple-percolation structures; Carbon compounds; Conducting materials; Conductivity; Dielectrics and electrical insulation; Electrostatic discharge; Glass; Organic materials; Plastic insulation; Polymers; Viscosity;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/6104.895067

Filename

895067