DocumentCode :
1424671
Title :
Innovative ESD thermoplastic composites structured through melt flow processing
Author :
Narkis, Moshe ; Lidor, Gershon ; Vaxman, Anita ; Zuri, Limor
Author_Institution :
Dept. of Chem. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
Volume :
23
Issue :
4
fYear :
2000
fDate :
10/1/2000 12:00:00 AM
Firstpage :
239
Lastpage :
245
Abstract :
The amount of carbon black required to impart electrical conductivity to an insulating polymer can be dramatically reduced by its selective localization in a multi-component system which includes the insulating polymer The present report describes property-structure relationships of polypropylene/nylon/glass fiber (PP/PA/GF) composites with consistent resistivity levels within the 106-109 ohms/sq range achieved at very low carbon black loadings (less than 2%). The quaternary composites studied structure spontaneously during the hot compounding/processing steps and have unique triple-percolation structures. The results were compared with typical carbon black filled materials, which usually contain 15 to 20 wt% carbon black and are too conductive to meet the 106-109 ohms/sq range
Keywords :
conducting polymers; electrical conductivity; electrostatic discharge; filled polymers; glass fibre reinforced plastics; packaging; ESD thermoplastic composites; carbon black loadings; consistent resistivity levels; electrical conductivity; hot compounding/processing steps; insulating polymer; melt flow processing; multi-component system; polypropylene/nylon/glass fiber composites; selective localization; triple-percolation structures; Carbon compounds; Conducting materials; Conductivity; Dielectrics and electrical insulation; Electrostatic discharge; Glass; Organic materials; Plastic insulation; Polymers; Viscosity;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/6104.895067
Filename :
895067
Link To Document :
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