DocumentCode
1426052
Title
Making GaAs integrated circuits
Author
Kirkpatrick, Conilee G.
Author_Institution
Sci. Appl. Int. Corp., Thousand Oaks, CA, USA
Volume
76
Issue
7
fYear
1988
fDate
7/1/1988 12:00:00 AM
Firstpage
792
Lastpage
815
Abstract
Digital gallium arsenide (GaAs) integrated circuits offer prospects for high-performance electronics, particularly for increased speed and radiation hardness. Prototype GaAs devices fabricated in technologies ranging from ion-implanted metal semiconductor field-effect transistors (MESFETs) and junction field-effect transistors (JFETs) to epitaxial heterostructures, such as high-electron-mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs), have demonstrated these advantages. While these GaAs technologies share many common fabrication features, the unique characteristics of each and GaAs materials present significant manufacturing challenges. It is argues that to produce real integrated circuits (ICs) for system applications, the disciplines and rigors of a production environment as well as the innovations of research and development are required
Keywords
III-V semiconductors; digital integrated circuits; integrated circuit technology; monolithic integrated circuits; GaAs integrated circuits; digital ICs; epitaxial heterostructures; heterojunction bipolar transistors; high-electron-mobility transistors; ion-implanted metal semiconductor field-effect transistors; junction field-effect transistors; manufacturing challenges; production environment; radiation hardness; speed; Digital integrated circuits; FETs; Gallium arsenide; HEMTs; High speed integrated circuits; Integrated circuit technology; JFETs; MESFETs; MODFETs; Prototypes;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/5.7144
Filename
7144
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