• DocumentCode
    1426052
  • Title

    Making GaAs integrated circuits

  • Author

    Kirkpatrick, Conilee G.

  • Author_Institution
    Sci. Appl. Int. Corp., Thousand Oaks, CA, USA
  • Volume
    76
  • Issue
    7
  • fYear
    1988
  • fDate
    7/1/1988 12:00:00 AM
  • Firstpage
    792
  • Lastpage
    815
  • Abstract
    Digital gallium arsenide (GaAs) integrated circuits offer prospects for high-performance electronics, particularly for increased speed and radiation hardness. Prototype GaAs devices fabricated in technologies ranging from ion-implanted metal semiconductor field-effect transistors (MESFETs) and junction field-effect transistors (JFETs) to epitaxial heterostructures, such as high-electron-mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs), have demonstrated these advantages. While these GaAs technologies share many common fabrication features, the unique characteristics of each and GaAs materials present significant manufacturing challenges. It is argues that to produce real integrated circuits (ICs) for system applications, the disciplines and rigors of a production environment as well as the innovations of research and development are required
  • Keywords
    III-V semiconductors; digital integrated circuits; integrated circuit technology; monolithic integrated circuits; GaAs integrated circuits; digital ICs; epitaxial heterostructures; heterojunction bipolar transistors; high-electron-mobility transistors; ion-implanted metal semiconductor field-effect transistors; junction field-effect transistors; manufacturing challenges; production environment; radiation hardness; speed; Digital integrated circuits; FETs; Gallium arsenide; HEMTs; High speed integrated circuits; Integrated circuit technology; JFETs; MESFETs; MODFETs; Prototypes;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/5.7144
  • Filename
    7144