Title :
Bridging the Interconnection Density Gap for Exascale Computation
Author :
Stevenson, Daniel S. ; Conn, Robert O.
Abstract :
Three-dimensional silicon interposers are the basis for an architectural approach that bridges the interconnection density between FR-4 printed circuit boards and silicon ICs. The promise is increased performance and less complexity relative to monolithic silicon-based designs.
Keywords :
integrated circuit interconnections; monolithic integrated circuits; printed circuits; FR-4 printed circuit boards; exascale computation; interconnection density gap; silicon IC; three dimensional silicon interposers; Optical fiber devices; Optical fibers; Printed circuits; Silicon; Three dimensional displays; 3D Silicon interposers; Exascale computing; Interconnection architecture; Silicon ICs;
