• DocumentCode
    1426651
  • Title

    Engineering applications of plasma science

  • Author

    Gilmore, Mark

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • Volume
    17
  • Issue
    3
  • fYear
    1998
  • Firstpage
    4
  • Lastpage
    8
  • Abstract
    Plasmas are important in such diverse fields as astrophysics, controlled fusion research, semiconductor manufacturing and laser technology. Plasma science incorporates skills from electromagnetics, thermodynamics, materials science, chemistry, electronics, mechanical design, vacuum technology and computer modeling. Plasma is involved in up to 30% of the steps in fabricating today´s microprocessors. Microwave tubes are a multibillion dollar market worldwide. Plasma processing within integrated circuit manufacturing is a $2 billion/year industry in the United States alone. The author discusses some engineering applications of plasma science, including: etching; deposition/coating; surface treatment; microwave vacuum tubes; pollution and hazardous waste processing; lasers; coronas
  • Keywords
    corona; fusion reactors; microwave tubes; plasma CVD; plasma CVD coatings; plasma applications; plasma confinement; pollution control; sputter etching; surface treatment; vacuum tubes; astrophysics; chemistry; coating; computer modeling; controlled fusion research; coronas; deposition; electromagnetics; electronics; engineering applications; etching; hazardous waste processing; integrated circuit manufacture; laser technology; lasers; materials science; mechanical design; microprocessors; microwave tubes; microwave vacuum tubes; plasma processing; plasma science; pollution; semiconductor manufacturing; surface treatment; thermodynamics; vacuum technology; Application software; Chemical technology; Integrated circuit technology; Laser theory; Masers; Materials science and technology; Nuclear and plasma sciences; Plasma applications; Plasma chemistry; Plasma materials processing;
  • fLanguage
    English
  • Journal_Title
    Potentials, IEEE
  • Publisher
    ieee
  • ISSN
    0278-6648
  • Type

    jour

  • DOI
    10.1109/45.714609
  • Filename
    714609