DocumentCode
1427476
Title
Effects of package parasitics on the performance of SAW filters
Author
Jatkar, Deepak D. ; Beker, Benjamin
Author_Institution
Hal Comput. Syst., Campbell, CA, USA
Volume
43
Issue
6
fYear
1996
Firstpage
1187
Lastpage
1194
Abstract
Effects of package parasitics on the performance of SAW filters were evaluated. A quasi-static approach based on the finite difference method (FDM) in conjunction with the current simulation method (CSM) was used to extract lumped element parameter values of common interconnections that are found in typical SAW packages. The influence of bond wire connections and package leads on the performance of common interdigital transducers (IDTs) was evaluated.
Keywords
UHF filters; equivalent circuits; finite difference methods; inductance; interdigital transducers; packaging; surface acoustic wave filters; IDT; SAW filter performance; SAW packages; bond wire connections; current simulation method; finite difference method; interconnections; interdigital transducers; lumped element parameter values; package leads; package parasitics; quasi-static approach; Anisotropic magnetoresistance; Bonding; Dielectric substrates; Equivalent circuits; Finite difference methods; Packaging; SAW filters; Surface acoustic waves; Transducers; Wire;
fLanguage
English
Journal_Title
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher
ieee
ISSN
0885-3010
Type
jour
DOI
10.1109/58.542063
Filename
542063
Link To Document