Title :
Effects of package parasitics on the performance of SAW filters
Author :
Jatkar, Deepak D. ; Beker, Benjamin
Author_Institution :
Hal Comput. Syst., Campbell, CA, USA
Abstract :
Effects of package parasitics on the performance of SAW filters were evaluated. A quasi-static approach based on the finite difference method (FDM) in conjunction with the current simulation method (CSM) was used to extract lumped element parameter values of common interconnections that are found in typical SAW packages. The influence of bond wire connections and package leads on the performance of common interdigital transducers (IDTs) was evaluated.
Keywords :
UHF filters; equivalent circuits; finite difference methods; inductance; interdigital transducers; packaging; surface acoustic wave filters; IDT; SAW filter performance; SAW packages; bond wire connections; current simulation method; finite difference method; interconnections; interdigital transducers; lumped element parameter values; package leads; package parasitics; quasi-static approach; Anisotropic magnetoresistance; Bonding; Dielectric substrates; Equivalent circuits; Finite difference methods; Packaging; SAW filters; Surface acoustic waves; Transducers; Wire;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
