Title :
A Crosstalk Reduction Technique for Microstrip MTL Using Mode Velocity Equalization
Author :
Lee, Jaejun ; Lee, Sungho ; Nam, Sangwook
Author_Institution :
Appl. Electromagn. Lab., Seoul Nat. Univ., Seoul, South Korea
fDate :
5/1/2011 12:00:00 AM
Abstract :
This paper proposes a simple method to enhance the timing margin of high-speed digital signals for multiconductor transmission lines (MTLs) in inhomogeneous media. It uses interline capacitances to implement the capacitance matrix homogenizing the original inhomogeneous structure. As a result, it equalizes the velocities of all the modes involved in the MTL structure simultaneously. The design equations are derived and the limitation of the proposed scheme is explained. For the experiment, a 100-mm three-line coupled microstrip MTL (M-MTL) is built. The measured total peak-to-peak jitter including crosstalk and other noises was 91 ps in the test structure. When the M-MTL is loaded by the proposed values of lumped capacitors between the adjacent lines, the jitter is reduced to 12 ps, whereas the measurement using the even/odd mode approach shows 22 ps jitter. All the measurement results are in good agreement with the theoretical values, which proves the effectiveness of the proposed method.
Keywords :
coupled transmission lines; crosstalk; electromagnetic coupling; interference suppression; jitter; matrix algebra; microstrip lines; multiconductor transmission lines; capacitance matrix; crosstalk reduction technique; electromagnetic coupling; even-odd mode approach; high-speed digital signals; inhomogeneous media; interline capacitance; lumped capacitors; mode velocity equalization; multiconductor transmission lines; peak-to-peak jitter; three-line coupled microstrip MTL structure; time 12 ps; time 22 ps; time 91 ps; timing margin enhancement; Capacitance; Capacitors; Couplings; Crosstalk; Jitter; Transmission line matrix methods; Transmission line measurements; Coupled transmission lines; crosstalk; electromagnetic coupling; jitters; transmission line;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2010.2095018