Title :
Monitoring multistage integrated circuit fabrication processes
Author :
Rao, Suraj ; Strojwas, Andrzej J. ; Lehoczky, J.P. ; Schervish, M.J.
Author_Institution :
Semicond. Process & Design Center, Texas Instrum. Inc., Dallas, TX, USA
fDate :
11/1/1996 12:00:00 AM
Abstract :
This paper presents a process monitoring system, which is designed to be used for monitoring VLSIC and other multistage manufacturing processes. The proposed process monitor can 1) simultaneously detect a variety of out-of-control conditions, 2) quantify the magnitude of process change, and 3) be used to compute the probability of meeting specifications. Average run length simulations show that for a single-stage process, the monitor is at least as good as the Shewhart-CUSUM charts for detecting changes in the distribution of the monitored characteristics. For a multistage process, however, the Bayesian monitor can significantly reduce the detection time by using in-line correlation information from earlier stages. The monitor has been applied to data from a state-of-the-art fabrication facility, and the results are promising
Keywords :
Bayes methods; VLSI; integrated circuit technology; semiconductor process modelling; Bayesian monitor; VLSIC; in-line correlation; integrated circuit fabrication; multistage manufacturing; process monitoring; simulation; Bayesian methods; Circuits; Computational modeling; Condition monitoring; Control charts; Covariance matrix; Fabrication; Manufacturing processes; Observability; Process control;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on